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quantitative analysis of faults and failures with multiple releases of softpm
Wu Shujian; Wang Qing; Yang Ye
2008
Conference NameACM/IEEE International Sympsoium on Empirical Software Engineering and Measurement
SourceESEM08: Proceedings of the 2008 ACM-IEEE International Symposium on Empirical Software Engineering and Measurement
Pages198-205
Conference Date44113
Conference PlaceKaiserslautern, GERMANY
Publish Place1515 BROADWAY, NEW YORK, NY 10036-9998 USA
PublisherESEM08: PROCEEDINGS OF THE 2008 ACM-IEEE INTERNATIONAL SYMPOSIUM ON EMPIRICAL SOFTWARE ENGINEERING AND MEASUREMENT
ISBN978-1-59593-971-5
DepartmentWu, Shujian; Wang, Qing; Yang, Ye Chinese Acad Sci, Inst Software, Lab Internet Software Technol, Beijing 100190, Peoples R China.
English AbstractTo date, very little published empirical data has reported on the quality and reliability aspects of commercial software systems. In this paper, we present quantitative empirical study results on faults and failures with four releases of SoftP
KeywordSoftware Faults And Failures Metrics Empirical Studies
SponsorshipACM SIGSOFT, IEEE CS, Siemens AG, Robert Bosch GmbH
Content Type会议论文
URIhttp://ir.iscas.ac.cn/handle/311060/10726
Collection互联网软件技术实验室
Recommended Citation
GB/T 7714
Wu Shujian,Wang Qing,Yang Ye. quantitative analysis of faults and failures with multiple releases of softpm[C]. 1515 BROADWAY, NEW YORK, NY 10036-9998 USA:ESEM08: PROCEEDINGS OF THE 2008 ACM-IEEE INTERNATIONAL SYMPOSIUM ON EMPIRICAL SOFTWARE ENGINEERING AND MEASUREMENT,2008:198-205.
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